Title :
Flip-chip solder bonding for microsystems
Author_Institution :
GEC-Marconi Mater. Technol. Ltd., Towcester, UK
Abstract :
Flip-chip solder bonding is a well established method for performing simultaneous interconnection and mechanical mounting of microelectronic components. It has recently been enjoying a resurgence of interest for assembly of microsystems on account of a unique process attribute, namely that the components being joined are precisely and repeatably aligned in three orthogonal directions. Sub-micron accuracy is readily achieved
Keywords :
flip-chip devices; assembly; flip-chip solder bonding; interconnection; mechanical mounting; microelectronic component; microsystem; precision alignment;
Conference_Titel :
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19970021
