DocumentCode
2592590
Title
Novel low expansion packages for electronics
Author
Sangha, S.P.S. ; Jacobson, D.M. ; Harrison, M.R.
Author_Institution
Hirst Div., GEC-Marconi Mater. Technol. Ltd., Borehamwood, UK
fYear
1997
fDate
35487
Firstpage
42461
Lastpage
42463
Abstract
As part of a four year BRITE/EURAM collaborative project supported by the European Commission, GMMT is evaluating new low expansion alloys based on new aluminium-silicon duplex alloys for packages for housing semiconductor devices. The new materials are superior to packages made from competing materials in terms of weight, cost and geometrical versatility without detriment to other properties
Keywords
semiconductor device packaging; Al-Si; BRITE/EURAM collaborative project; European Commission; GMMT; aluminium-silicon duplex alloy; electronics; housing; low expansion package; semiconductor device;
fLanguage
English
Publisher
iet
Conference_Titel
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19970022
Filename
597322
Link To Document