• DocumentCode
    2592660
  • Title

    Analysis on decoupling capacitor placement associated with power and return plane bounce

  • Author

    Montrose, Mark I.

  • Author_Institution
    Montrose Compliance Services, Inc., Montrose, CO, USA
  • fYear
    2012
  • fDate
    21-24 May 2012
  • Firstpage
    425
  • Lastpage
    428
  • Abstract
    Decoupling capacitors minimize both power and return plane bounce developed in power distribution networks when digital components transition logic states. State changes causes significant current spikes in the power and image rails at every edge time and are sometimes called “ground bounce” or “shoot-through” potentials. If there is insufficient energy storage for both the power and return pins, plane bounce will occur. Which plane bounces depends on system and printed circuit board design and layout, particularly in regard to the location of the signal via escape anti-pads compared to the position of the decoupling capacitors. If plane bounce exceeds voltage tolerance margins, functional operation is not ensured resulting in signal integrity problems as well as development of common-mode electromagnetic interference (EMI). We investigate the magnitude of plane bounce at different locations with multiple components switching simultaneously, both with and without decoupling capacitors.
  • Keywords
    distribution networks; electromagnetic interference; power capacitors; printed circuit layout; EMI; common-mode electromagnetic interference; decoupling capacitor placement; digital components transition logic states; energy storage; ground bounce potentials; power distribution networks; printed circuit board design and layout; return plane bounce; shoot-through potentials; voltage tolerance margins; Capacitance; Capacitors; Electromagnetic interference; Image edge detection; Pins; Programmable logic arrays; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1557-0
  • Electronic_ISBN
    978-1-4577-1558-7
  • Type

    conf

  • DOI
    10.1109/APEMC.2012.6237806
  • Filename
    6237806