• DocumentCode
    2593211
  • Title

    Improving the high-frequency performance of integrated EMI filter with multiple ground layers

  • Author

    Huang, Hui-fen ; Deng, Liang-yong

  • Author_Institution
    Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
  • fYear
    2012
  • fDate
    21-24 May 2012
  • Firstpage
    249
  • Lastpage
    252
  • Abstract
    In this paper, a novel structural winding arrangement is proposed to improve the high-frequency characteristics of the integrated EMI filter. Two ground winding layers are introduced to couple with common-mode (CM) choke winding to implement the CM capacitors so that the common mode EMI filter becomes a two-stage filter. Simulated by the Finite Element Analyze (FEA) software, the second resonance peak of transmission gain brought by the equivalent series inductance (ESL) is sharply decreased compared to the original structure to improve the high-frequency performance. In order to better analyze the proposed structure, the structural winding capacitance model of the planar spiral winding structure is given and the equivalent circuit is derived. Simulated and experimental results are included and they confirm the filtering effectiveness of the integrated planar EMI filter.
  • Keywords
    capacitors; electromagnetic interference; finite element analysis; power convertors; power electronics; windings; CM capacitors; ESL; FEA; common-mode choke winding; equivalent series inductance; filtering effectiveness; finite element analyze software; high-frequency characteristics; high-frequency performance; integrated planar EMI filter; multiple ground layers; planar spiral winding structure; second resonance peak; structural winding capacitance model; two ground winding layers; Capacitance; Capacitors; Electromagnetic interference; Equivalent circuits; Inductance; Inductors; Windings;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1557-0
  • Electronic_ISBN
    978-1-4577-1558-7
  • Type

    conf

  • DOI
    10.1109/APEMC.2012.6237836
  • Filename
    6237836