Title :
Review of conductive adhesives and inks for microengineered devices
Author :
Bartholomew, P.M.
Author_Institution :
Multicore Solders Ltd., Hemel Hempstead, UK
Abstract :
The availability of high performance conductive thermoplastic adhesives offers the benefits of enhanced thermal conductivity, control of thermo-mechanical stress, and simple rework procedures in microengineered components. Versatile polymer thick film inks, having a wide range of electrical resistivities, may play a significant future role in low cost sensor packaging technology due to their compatibility with moulded plastic cavity packages
Keywords :
packaging; conductive thermoplastic adhesive; electrical resistivity; microengineered device; moulded plastic cavity; polymer thick film ink; rework; sensor packaging; thermal conductivity; thermomechanical stress;
Conference_Titel :
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19970024
