DocumentCode
2593500
Title
Review of conductive adhesives and inks for microengineered devices
Author
Bartholomew, P.M.
Author_Institution
Multicore Solders Ltd., Hemel Hempstead, UK
fYear
1997
fDate
35487
Firstpage
42522
Lastpage
42524
Abstract
The availability of high performance conductive thermoplastic adhesives offers the benefits of enhanced thermal conductivity, control of thermo-mechanical stress, and simple rework procedures in microengineered components. Versatile polymer thick film inks, having a wide range of electrical resistivities, may play a significant future role in low cost sensor packaging technology due to their compatibility with moulded plastic cavity packages
Keywords
packaging; conductive thermoplastic adhesive; electrical resistivity; microengineered device; moulded plastic cavity; polymer thick film ink; rework; sensor packaging; thermal conductivity; thermomechanical stress;
fLanguage
English
Publisher
iet
Conference_Titel
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19970024
Filename
597327
Link To Document