DocumentCode
2594263
Title
Effects of Mica Nanofillers on the Complex Permittivity of Polyamide Nanocomposites
Author
Fuse, N. ; Sato, H. ; Tanaka, T. ; Ohki, Y.
Author_Institution
Dept. of Electr. Eng. & Biosci., Waseda Univ., Shinjuku
fYear
2008
fDate
26-29 Oct. 2008
Firstpage
540
Lastpage
543
Abstract
Effects of nanofiller loading on the carrier transport and molecular motion in polyamide-6/mica nanocomposites were discussed by analyzing their complex permittivity spectra. As a result, the following four dielectric polarization processes were observed; space charge polarization, alpha relaxation due to dipolar orientation, and beta relaxation due to rotation of amide groups bonded with water molecules, in addition to interfacial polarization at crystalline/amorphous boundaries. The enhancement of dielectric constant and that of loss factor due to abundance of mobile charge carriers are suppressed by the nanofiller loading. These results suggest that carrier transport is suppressed by the nanofillers. Furthermore, it was found that relaxation time becomes longer by the mica nanofiller loading both for the dipolar orientation and for the rotation of amide groups. Molecular motion is considered to be restricted in nanocomposites, which indicates a strong interaction between the resin and filler.
Keywords
dielectric polarisation; mica; nanocomposites; permittivity; alpha relaxation; beta relaxation; complex permittivity spectra; crystalline-amorphous boundaries; dielectric constant enhancement; dielectric polarization processes; dipolar orientation; interfacial polarization; mica nanofiller loading; mobile charge carriers; molecular motion; polyamide nanocomposites; space charge polarization; Amorphous materials; Bonding; Crystallization; Dielectric constant; Dielectric losses; Motion analysis; Nanocomposites; Permittivity; Polarization; Space charge;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
Conference_Location
Quebec, QC
Print_ISBN
978-1-4244-2548-8
Electronic_ISBN
978-1-4244-2549-5
Type
conf
DOI
10.1109/CEIDP.2008.4772784
Filename
4772784
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