DocumentCode :
2594434
Title :
Low-profile broadband Core-Isolator for multi-band module
Author :
Wada, Tomotaka ; Hasegawa, T. ; Koshino, Masayoshi ; Okada, Takashi
Author_Institution :
Murata Manufacturing Co., Ltd, Yasu-shi, Japan
fYear :
2011
fDate :
5-10 June 2011
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given, as follows. A novel broadband Core-Isolator for modules of multi-standard and multi-band mobile handsets has been developed successfully. A new circuit configuration for extending the isolation frequency band is proposed. A 1.5 × 0.9 × 0.4 mm3 Core-Isolator with two electrodes of asymmetrical structure has been fabricated, which is mounted on a module substrate with resonant elements. It has an insertion loss of 0.5dB and an isolation of 10dB at 824–915MHz which is twice wider than conventional one.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location :
Baltimore, MD
ISSN :
0149-645X
Print_ISBN :
978-1-61284-754-2
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2011.5973322
Filename :
5973322
Link To Document :
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