System power integrity impact by package power/ground balls assignment and decoupling capacitors

Power integrity is one of the important issues of system design. Power and current levels are expected to increase with a corresponding to decrease in the voltage and increment of I/O number. Based on these factors, system designer faces the challenge on power delivery network. The power/ground (P/G) ball is often used as a link between the package and printed circuit board (PCB). It relates to the system power distribution from the voltage regulator module (VRM) to IC. When considering the power delivery network (PDN) design, power/ground balls position is the key point for complete power delivery. In this research, the assignment of the power/ground balls at different places and improvement of resonance impedance with different decoupling capacitors have been investigated for the impact of power integrity. The proposed arrangement of power/ground balls position is presented. The parasitic effects for different conditions of system design are extracted for comparison. The simulation results confirm with our theoretical analysis.