DocumentCode :
2594877
Title :
Barbed transmission lines for crosstalk suppression
Author :
Wu, Boping ; Mo, Tingting
Author_Institution :
Intel Corp., Folsom, CA, USA
fYear :
2012
fDate :
21-24 May 2012
Firstpage :
621
Lastpage :
624
Abstract :
As the increasing demand of small form factor and low-cost package drives the interconnect density, crosstalk noise due to the parasitic components set the limitation in off-die high speed signaling. This paper presents a barbed transmission line design to eliminate the far-end crosstalk by adding periodical stubs on the original microstrip structures. By purposely increasing the mutual capacitance, the signal discontinuity of microstrip line design is greatly improved for the multi-gigabit/second links in IC packages. The parametric analysis on stub tuning is given with geometric structures. The time-domain noise simulations and frequency domain crosstalk assessment are performed in accompany with the hardware experiments to verify the proposed concept.
Keywords :
high-frequency transmission lines; integrated circuit packaging; microstrip lines; time-frequency analysis; IC packages; barbed transmission line design; crosstalk noise; crosstalk suppression; far-end crosstalk; frequency domain crosstalk assessment; interconnect density; low-cost package drives; microstrip line design; microstrip structures; multigigabit-second links; off-die high speed signaling; parasitic components; time-domain noise simulations; Copper; Electromagnetics; Fabrication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1557-0
Electronic_ISBN :
978-1-4577-1558-7
Type :
conf
DOI :
10.1109/APEMC.2012.6237933
Filename :
6237933
Link To Document :
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