• DocumentCode
    2594877
  • Title

    Barbed transmission lines for crosstalk suppression

  • Author

    Wu, Boping ; Mo, Tingting

  • Author_Institution
    Intel Corp., Folsom, CA, USA
  • fYear
    2012
  • fDate
    21-24 May 2012
  • Firstpage
    621
  • Lastpage
    624
  • Abstract
    As the increasing demand of small form factor and low-cost package drives the interconnect density, crosstalk noise due to the parasitic components set the limitation in off-die high speed signaling. This paper presents a barbed transmission line design to eliminate the far-end crosstalk by adding periodical stubs on the original microstrip structures. By purposely increasing the mutual capacitance, the signal discontinuity of microstrip line design is greatly improved for the multi-gigabit/second links in IC packages. The parametric analysis on stub tuning is given with geometric structures. The time-domain noise simulations and frequency domain crosstalk assessment are performed in accompany with the hardware experiments to verify the proposed concept.
  • Keywords
    high-frequency transmission lines; integrated circuit packaging; microstrip lines; time-frequency analysis; IC packages; barbed transmission line design; crosstalk noise; crosstalk suppression; far-end crosstalk; frequency domain crosstalk assessment; interconnect density; low-cost package drives; microstrip line design; microstrip structures; multigigabit-second links; off-die high speed signaling; parasitic components; time-domain noise simulations; Copper; Electromagnetics; Fabrication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1557-0
  • Electronic_ISBN
    978-1-4577-1558-7
  • Type

    conf

  • DOI
    10.1109/APEMC.2012.6237933
  • Filename
    6237933