• DocumentCode
    2595044
  • Title

    Insertion of parallel RL circuits into power distribution network for simultaneous switching current reduction and power integrity

  • Author

    Iokibe, Kengo ; Yano, Yusuke ; Toyota, Yoshitaka

  • Author_Institution
    Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan
  • fYear
    2012
  • fDate
    21-24 May 2012
  • Firstpage
    417
  • Lastpage
    420
  • Abstract
    We investigated a method using parallel RL circuits inserted into power distribution network (PDN) of integrated circuits (ICs) to enhance the IC in EMI and PI performance. Optimal damping resistances of the parallel RL circuit were derived from a characteristic equation of an equivalent circuit of a partial PDN that contributed to PDN resonances dominantly. The parallel RL circuit with the optimal resistances damps the PDN resonances as quickly as possible and reduces peaks in simultaneous switching current that will cause EMI and in input impedance of PDN related to PI. We validated the parallel RL circuit with respect to EMI and PI performance of ICs numerically and experimentally. Results of these validation showed that the proposed method descend the simultaneous switching current at both chip-package-board and on-board resonant frequency. It is also confirmed that insertion of the parallel RL circuits into the power trace reduced the impedance peak due to the chip-package-board resonance.
  • Keywords
    chip-on-board packaging; damping; electromagnetic interference; equivalent circuits; integrated circuit design; integrated circuit interconnections; interference suppression; switching circuits; EMI; PDN; PI performance; chip-package-board resonance; equivalent circuit; integrated circuit; on-board resonant frequency; optimal damping resistance; parallel RL circuit; power distribution network; power integrity; simultaneous switching current reduction; Crystals; Dielectrics; Electromagnetic compatibility; RLC circuits; Resonant frequency; Shock absorbers; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1557-0
  • Electronic_ISBN
    978-1-4577-1558-7
  • Type

    conf

  • DOI
    10.1109/APEMC.2012.6237943
  • Filename
    6237943