DocumentCode
2595539
Title
Directional dilation for the connection of piece-wise objects: a semiconductor manufacturing case study
Author
Gleason, Sham S. ; Tobin, Kenneth W.
Author_Institution
Oak Ridge Nat. Lab., TN, USA
Volume
3
fYear
1996
fDate
16-19 Sep 1996
Firstpage
9
Abstract
A technique for intelligent dilation of objects in an image was developed that, when compared to standard isotropic techniques, can create a better representative resultant image for subsequent morphological analysis. Individual masses in an image are forced to grow in preferential directions with varying degrees of strength according to a set of morphological parameters. These parameters are determined by applying a model based on gravitational force to determine the strength and direction of the “attraction force” between objects. The result of this analysis is a collection of normalized dilation vectors for each object in the image, where each vector represents a potential direction for growth. Results of the application of this algorithm are shown on binary images of defect distributions on semiconductor wafers where a single defect (e.g., a scratch) can be made up of numerous, disconnected blobs
Keywords
image representation; image segmentation; mathematical morphology; semiconductor device manufacture; semiconductor technology; algorithm; attraction force direction; attraction force strength; binary images; defect distributions; directional dilation; gravitational force; image region; image representation; intelligent dilation; isotropic techniques; morphological analysis; morphological parameters; normalized dilation vectors; piecewise objects connection; scratch; semiconductor manufacture; semiconductor wafers; Computer aided software engineering; Contracts; Image analysis; Kernel; Laboratories; Object detection; Performance analysis; Semiconductor device manufacture; Shape control; Standards development;
fLanguage
English
Publisher
ieee
Conference_Titel
Image Processing, 1996. Proceedings., International Conference on
Conference_Location
Lausanne
Print_ISBN
0-7803-3259-8
Type
conf
DOI
10.1109/ICIP.1996.560356
Filename
560356
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