Title :
Configurable platform for SoC combined tests of TID radiation, aging and EMI
Author :
Benfica, J. ; Bolzani Poehls, Leticia ; Vargas, F. ; Lipovetzky, Jose ; Lutenberg, Ariel ; García, Sebastian E.
Author_Institution :
Electr. Eng. Dept., Catholic Univ. - PUCRS, Porto Alegre, Brazil
Abstract :
The roadmap for standardization of electromagnetic (EM) immunity measurement methods has reached a high degree of success with the IEC 62.132 proposal. The same understanding can be taken from the MIL-STD-883H for total ionizing dose (TID) radiation and burn-in (for aging purpose). However, no effort has been performed to measure the behavior of electronics operating under the combined effects of EM noise, TID radiation and aging. For secure embedded systems and systems-on-chip (SoC) devoted to critical applications, these combined-effect measurements are mandatory. In this paper, we present a configurable platform devoted to perform these combined tests on FPGA-prototyped SoC. The platform attends the IEC 62.132-2 (for radiated EM noise), IEC 61.000-4-17 and IEC 61.000-4-29 (for conducted EM disturbance) and methods 1019.4 for TID and 1015.9 for Burn-in Test Procedures of MIL-STD-883H.
Keywords :
IEC standards; ageing; electromagnetic interference; embedded systems; field programmable gate arrays; integrated circuit testing; system-on-chip; EM immunity measurement method; EM noise; EMI testing; FPGA-prototype; MIL-STD-883H; SoC; TID radiation testing; aging testing; burn-in test procedure; combined-effect measurement; conducted EM disturbance; electromagnetic immunity measurement method; electronic measurement; embedded system; lEC 61.000-4-17 standard; lEC 61.000-4-29 standard; lEC 62.132 standard; systems-on-chip; total ionizing dose radiation testing; Clocks; Computer architecture; Field programmable gate arrays; Microprocessors; Noise; Standards; System-on-a-chip; Combined reliability tests; Precertification testing platform; Safety system-on-chip;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1557-0
Electronic_ISBN :
978-1-4577-1558-7
DOI :
10.1109/APEMC.2012.6237989
