Title :
Manhole Events Caused by Secondary Cable Insulation Breakdown
Author :
Zhang, Lily ; Boggs, Steven A. ; Livanos, Stavros
Author_Institution :
Inst. of Mater. Sci., Univ. of Connecticut, Storrs, CT
Abstract :
Utilities continue to experience electrically induced manhole events. Eighty-five percent of manhole events are caused by insulation breakdown, and 97% of the breakdowns occur on secondary cable insulation. The vast majority of manhole events involve only smoke, but a very small minority involve more serious phenomena. The restrictive conditions under which secondary cable insulation breakdown leads to dangerous manhole events needs to be understood. To approach this issue, thermal decomposition of secondary cable insulation was investigated in a simulated duct environment. Sustained decomposition is achieved under both aerobic and anaerobic conditions. The consequences of insulation degradation as a function of temperature with varying oxygen concentration has been monitored using a residual gas analyzer, and the thermal decomposition rate of the cable dielectric has been measured using TGA. Based on this investigation, we are approaching an understanding of the restrictive conditions which lead to serious manhole events.
Keywords :
chemical variables measurement; electric breakdown; insulation testing; power cable insulation; power cable testing; pyrolysis; thermal analysis; TGA; aerobic condition; anaerobic condition; cable dielectric breakdown; electrically-induced manhole event; insulation degradation; oxygen concentration monitoring; residual gas analyzer; secondary cable insulation breakdown; simulated duct environment; thermal decomposition; Cable insulation; Dielectrics and electrical insulation; Ducts; Electric breakdown; Explosives; Gas insulation; Gases; Polymers; Power cables; Thermal decomposition; aerobic/anaerobic thermal decomposition; insulation breakdown; manhole event;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
Conference_Location :
Quebec, QC
Print_ISBN :
978-1-4244-2548-8
Electronic_ISBN :
978-1-4244-2549-5
DOI :
10.1109/CEIDP.2008.4772895