DocumentCode :
2596081
Title :
The development of thin plate, pure lead VRLA batteries for telecommunications applications in challenging environments
Author :
Peng, Shawn ; Yuan, Fang
Author_Institution :
Leoch Int. Technol. Ltd., Shenzhen, China
fYear :
2011
fDate :
9-13 Oct. 2011
Firstpage :
1
Lastpage :
5
Abstract :
A new range of thin plate, pure lead VRLA batteries has been developed for use in environments where the temperature conditions and power quality put limitations on the service life of conventional batteries. These batteries use punched grids with a special alloy containing a carefully balanced amount of tin which prevents the formation of insulating layers at the grid/active material interface under conditions of deep discharge. The use of punched grids permits the use of thinner plates than in conventional VRLA batteries leading to enhanced performance both on discharge and charge acceptance for recharge. This type of battery provides a solution to the more onerous demands of decentralised power with extremes of temperature, cyclic requirements and intermittent deep discharges that are increasingly found in telecommunications applications. The construction and technical performance of the battery will be described and areas for successful deployment outlined.
Keywords :
discharges (electric); insulating materials; lead acid batteries; power supply quality; telecommunication power supplies; grid-active material interface; insulating layers; intermittent deep discharges; power quality; punched grids; telecommunications applications; thin plate pure lead VRLA battery; Assembly; Lead; Polymers; Resins; Welding; battery; lead/acid; punched grids; pure lead; telecommunications; valve-regulated;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Telecommunications Energy Conference (INTELEC), 2011 IEEE 33rd International
Conference_Location :
Amsterdam
ISSN :
2158-5210
Print_ISBN :
978-1-4577-1249-4
Electronic_ISBN :
2158-5210
Type :
conf
DOI :
10.1109/INTLEC.2011.6099832
Filename :
6099832
Link To Document :
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