Title :
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
Abstract :
The following topics are dealt with: advanced packaging; package thermal performance; advanced manufacturing; simulation of package reliability; advanced interconnects; advanced materials and processes; MEMS packaging; reliability characterization; RF components and modules; thermal modelling and enhanced cooling solutions; simulation of solder joint reliability; interconnect metallurgies; optoelectronics - fabrications and processes; reliability - experimental techniques; flip chip technologies; electrical characterization and testing; mechanical modelling techniques; liquid cooling and microchannel heat sinks; 3D packaging; flip chip materials and processes; electrical design and modelling; simulation of drop impact; wire bonding; mechanical characterization; reliability modelling and analysis.
Keywords :
flip-chip devices; heat sinks; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; integrated optoelectronics; lead bonding; soldering; 3D packaging; MEMS packaging; RF components; RF modules; advanced interconnects; advanced manufacturing; advanced materials; advanced packaging; advanced processes; drop impact simulation; electrical characterization; electrical design; electrical modelling; electrical testing; enhanced cooling solutions; flip chip materials; flip chip processes; flip chip technologies; interconnect metallurgies; liquid cooling; mechanical characterization; mechanical modelling techniques; microchannel heat sinks; optoelectronics fabrication; optoelectronics processes; package reliability simulation; package thermal performance; reliability analysis; reliability characterization; reliability modelling; reliability techniques; solder joint reliability; thermal modelling; wire bonding;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Conference_Location :
Singapore
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396557
