• DocumentCode
    2596426
  • Title

    FEA computations of temperature pattern in interstitial thermal therapy of brain tumours: The case of ultrasound applicators

  • Author

    Jarosz, B.J.

  • Author_Institution
    Ottawa-Carleton Inst. for Phys., Carleton Univ., Ottawa, ON, Canada
  • fYear
    2009
  • fDate
    5-7 May 2009
  • Firstpage
    446
  • Lastpage
    450
  • Abstract
    We discuss details of thermal therapy of brain tumors carried out with ultrasound interstitial instrumentation. A case of heating with four applicators placed in the tumor region is discussed. The blood flow influence on temperature pattern is examined using finite element analysis. This influence is illustrated for an arteriole splitting into 1.1- and 0.6-mm diameter branches passing near the tumor. Two blood flow values, 45 and 150 ml/min/(100 g), were investigated. The tumor of various structures is modeled: it is considered as a tissue of uniform physical properties or with its about 30% volume necrotic center of different physical properties. We found that the temperature pattern is strongly modified by both the tumor structure and the blood flow. It was also realized that the branches role was quite complex: while the smaller diameter branch could help in maintaining more uniform temperature, the larger diameter branch caused significant drop of temperature.
  • Keywords
    blood vessels; brain; cancer; finite element analysis; haemodynamics; hyperthermia; tumours; ultrasonic therapy; FEA computation; arteriole splitting; blood flow influence; brain tumour; finite element analysis; interstitial thermal therapy; temperature pattern; ultrasound interstitial instrumentation; Applicators; Blood flow; Finite element methods; Heating; Instruments; Medical treatment; Neoplasms; Temperature; Tumors; Ultrasonic imaging; FEA modeling; blood flow cooling; cancer therapy planning; thermal therapy instrumentatiion; ultrasound interstitial instrumentation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 2009. I2MTC '09. IEEE
  • Conference_Location
    Singapore
  • ISSN
    1091-5281
  • Print_ISBN
    978-1-4244-3352-0
  • Type

    conf

  • DOI
    10.1109/IMTC.2009.5168490
  • Filename
    5168490