Examination of thermal performance of board-level QFP with unattached drop-in heat spreader

Author

Wang, Tong Hong ; Lee, Chang-Chi ; Lai, Yi-Shao

Author_Institution

Stress-Reliability Lab., Adv. Semicond. Eng. Inc., Kaohsiung, China

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

36

Lastpage

40

Abstract

We evaluate the board-level thermal performance of QFP with an unattached drop-in heat spreader numerically. The die is given a power and induced thermomechanical deformations and corresponding gap distributions on the unattached interface between the heat spreader and the die pad are calculated through the 3D thermal-mechanical coupling analysis incorporated with contact methodologies. Thermal performances of the package with different interfacial conditions are examined and compared.

Keywords

chip-on-board packaging; finite element analysis; interface phenomena; thermal management (packaging); thermomechanical treatment; 3D thermal-mechanical coupling analysis; board-level QFP; board-level thermal performance; die pad; gap distribution; numerical evaluation; thermomechanical deformation; unattached drop-in heat spreader; Contact resistance; Costs; Electronic packaging thermal management; Electronics packaging; Finite element methods; Thermal engineering; Thermal expansion; Thermal resistance; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396573

Filename

1396573