Electrical properties of commercial sheet insulation materials for cryogenic applications

Author

Tuncer, Enis ; Sauers, Isidor ; James, D. Randy ; Ellis, Alvin R. ; Pace, Marshall O.

Author_Institution

Oak Ridge Nat. Lab., Oak Ridge, TN

fYear

2008

fDate

26-29 Oct. 2008

Firstpage

301

Lastpage

304

Abstract

Dielectric properties of electrical insulation materials are needed for low temperature power applications. Performance of materials and their compatibility determine the size of the electrical insulation in power equipment. In this work we report the dielectric properties of some commercially available materials in sheet form. The selected materials are polypropylene laminated paper from Sumitomo Electric Inc., porous polyethylene (Tyvektrade) from Dupont and polyamide paper (Nomextrade) from Dupont. The dielectric properties are characterized with an electrical impedance analyzer in the frequency domain. The impedances are recorded in a cryocooler in the temperature range from 50 K to 300 K. The dielectric breakdown characteristics of the materials are measured in a liquid nitrogen bath at atmospheric pressure.

Keywords

cryogenics; dielectric properties; electric breakdown; electric impedance; insulation; organic compounds; Dupont; Nomex; Sumitomo Electric Inc; Tyvek; commercial sheet insulation materials; cryocooler; cryogenic applications; dielectric breakdown; dielectric properties; electrical impedance analyzer; electrical insulation materials; electrical properties; liquid nitrogen bath; low temperature power applications; polyamide paper; polypropylene laminated paper; porous polyethylene; power equipment; temperature 50 K to 300 K; Atmospheric measurements; Cryogenics; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Frequency domain analysis; Impedance; Polyethylene; Sheet materials; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on

Conference_Location

Quebec, QC

Print_ISBN

978-1-4244-2548-8

Electronic_ISBN

978-1-4244-2549-5

Type

conf

DOI

10.1109/CEIDP.2008.4772931

Filename

4772931