Abstract :
The following topics are dealt with: low-temperature bonding in 3D integration; photonics applications; passivation; low-temperature wafer bonding; self-assembled monolayer; core-shell nanoparticles; infrared transmission acoustic microscopy; scanning acoustic microscopy; surface activated bonding; self-assembly-based 3D integration technology; low temperature metal interdiffusion bonding; wafer-level MEMS packaging; microfluidic bio-molecules detection system; 3D-TSV vertical interconnection method; and 3DIC integrated thin wafer handling.
Keywords :
acoustic microscopy; chemical interdiffusion; integrated circuit bonding; micromechanical devices; molecular biophysics; monolayers; nanoparticles; passivation; self-assembly; three-dimensional integrated circuits; 3D integration; 3D-TSV vertical interconnection method; 3DIC integrated thin wafer handling; core-shell nanoparticle; infrared transmission acoustic microscopy; low temperature metal interdiffusion bonding; low-temperature bonding; low-temperature wafer bonding; microfluidic bio-molecule detection system; passivation; photonics applications; scanning acoustic microscopy; self-assembled monolayer; self-assembly-based 3D integration technology; surface activated bonding; wafer-level MEMS packaging;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238034
