• DocumentCode
    2596716
  • Title

    The Influence of Corona Intensity on the TSC of HTV Silicone Rubber

  • Author

    Ding, Lijian ; Liang, Ying ; Tu, Youping ; Wang, Wei ; Li, C.R.

  • Author_Institution
    Beijing Key Lab. of High Voltage & EMC, North China Electr. Power Univ., Beijing, China
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    305
  • Lastpage
    308
  • Abstract
    In this paper, the influence of corona intensity on the TSC characteristics of HTV silicone rubber was investigated. Five levels of corona voltage were employed to deteriorate the samples respectively. The TSC was measured for the samples exposure different deteriorating duration. Experimental results show that the variation trend of TSC curves with the corona intensity is not identical at different deteriorating period. During the whole deterioration progress, the peak value of TSC gradually increases with the improvement of corona voltage. The temperature corresponded to TSC peak, however, becomes higher only when the corona voltage is elevated to a certain value at given corona deterioration period. Along with the prolonging of deterioration duration, the greater the corona intensity, the higher the temperature corresponded to TSC peak. The calculated traps parameters reveal that the trap energy level would not be deepened by strengthen of corona intensity. The reason was analyzed in this paper considering the microstructure variation.
  • Keywords
    corona; energy states; silicone rubber; HTV silicone rubber; TSC curves; corona deterioration period; corona intensity; corona voltage; microstructure variation; thermal stimulation current; trap energy level; traps parameters; Composite materials; Conducting materials; Corona; Dielectrics and electrical insulation; Electrodes; Microstructure; Rubber; Surface discharges; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
  • Conference_Location
    Quebec, QC
  • Print_ISBN
    978-1-4244-2548-8
  • Electronic_ISBN
    978-1-4244-2549-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2008.4772935
  • Filename
    4772935