DocumentCode
2596735
Title
Preface
fYear
2012
fDate
22-23 May 2012
Firstpage
1
Lastpage
1
Abstract
Presents the welcome message from the conference proceedings.
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238036
Filename
6238036
Link To Document