DocumentCode :
2596747
Title :
Conference committee
fYear :
2012
fDate :
22-23 May 2012
Firstpage :
1
Lastpage :
1
Abstract :
Provides a listing of current committee members.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo, Japan
Print_ISBN :
978-1-4673-0743-7
Type :
conf
DOI :
10.1109/LTB-3D.2012.6238037
Filename :
6238037
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2596747
