• DocumentCode
    2596747
  • Title

    Conference committee

  • fYear
    2012
  • fDate
    22-23 May 2012
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Provides a listing of current committee members.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
  • Conference_Location
    Tokyo, Japan
  • Print_ISBN
    978-1-4673-0743-7
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2012.6238037
  • Filename
    6238037