CSP die attach manufacturability for large thin die

The trend of ever-higher density devices, and consequently increasing die size, has brought along new challenges for semiconductor packaging design. The larger and thinner die requires particular considerations in quality, reliability and productivity aspects of die attach process. This work describes an experimental series of process characterization to obtain the die attach manufacturability mainly concerning either warping characteristic or pattern of organic substrate type in which bondline thickness (BLT) variation affecting adhesion between bottom die and substrate surfaces would become crucial in the process setup and control for the large thin die on chip scale package (CSP).