Design and fabrication of micro thermoelectric cooler on LTCC substrate

Author

Fan, W. ; Wong, C.K. ; Tan, Y.M. ; Chua, K.M. ; Freeman, Bill ; Jiang, H.J.

Author_Institution

Joining Technol. Group, Singapore Inst. of Manuf. Technol.

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

76

Lastpage

80

Abstract

The paper presents the design and fabrication of micro thermoelectric cooler (TEC) using LTCC process and SMT technique. Two micro thermoelectric module prototypes illustrate the construction and performance of the micro TECs. The micro TEC performance simulation results of the micro thermoelectric module indicate that the maximal parameters and performance curves can be optimized based on maximum current (I_max), maximum voltage (V_max), maximum cooling power (Q_max) and maximum temperature difference (DeltaT_max)

Keywords

ceramic packaging; cooling; micromechanical devices; surface mount technology; thermoelectric devices; LTCC process; LTCC substrate; SMT technique; maximum cooling power; maximum current; maximum temperature difference; maximum voltage; micro thermoelectric cooler; micro thermoelectric module prototype; performance simulation; Conducting materials; Cooling; Fabrication; High speed optical techniques; Modular construction; Optical pumping; Surface-mount technology; Temperature; Thermoelectricity; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Conference_Location

Singapore

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396580

Filename

1396580