Title :
Design flow and methodologies for 3D systems architectures exploiting heterogeneous technologies
Author_Institution :
R3Logic, Inc., Bedford, MA, USA
Abstract :
In order to meet the needs of 3DIC system designers and technologists, design tools must be truly 3D-aware in their ability to capture all relevant aspects of the 3D stack. These include not only the individual die layers, but the intervening bond layers and their thermal, electrical, and mechanical properties. We present the results of our efforts of many years to build a comprehensive front-to-back 3D design flow that blends seamlessly with existing 2D tools, while providing the added data structures and support needed to manage and optimize complex 3D designs.
Keywords :
integrated circuit design; three-dimensional integrated circuits; 2D tool; 3D systems architecture; data structure; design flow; front-to-back 3D design flow; heterogeneous technology; Computational modeling; Integrated circuit modeling; Layout; Materials; Through-silicon vias;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238042
