Low temperature metal and polymer bonding for advanced infrared imaging sensors

Author

Temple, Dorota S. ; Lueck, Matthew ; Malta, Dean ; Vick, Erik

Author_Institution

RTI Int., Research Triangle Park, NC, USA

fYear

2012

fDate

22-23 May 2012

Firstpage

31

Lastpage

31

Abstract

Low temperature bonding is a critical process module for high density 3-D integration technology as well as wafer-level 3-D packaging. This presentation will review the use of such 3-D integration technologies in advanced infrared imaging sensors. Designs based on 3-D architectures enable infrared cameras that are characterized by high performance, low power, low weight and a small form factor. Such cameras are expected to be used widely in defense, security and commercial markets. The presentation will highlight recent 3-D integration technology demonstrations at RTI that employ low temperature metal and polymer bonding. We have demonstrated 99.99% operability in large arrays of 3-D interconnects with pitches down to 10 μm.

Keywords

cryogenic electronics; image sensors; infrared imaging; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; wafer bonding; wafer-scale integration; 3D architectures; advanced infrared imaging sensors; high density 3D integration technology; high performance factor; infrared cameras; large 3D interconnect arrays; low power factor; low temperature metal bonding; low temperature polymer bonding; low weight factor; operability; process module; small form factor; wafer-level 3D packaging; Bonding; Infrared imaging; Integrated circuit interconnections; Metals; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4673-0743-7

Type

conf

DOI

10.1109/LTB-3D.2012.6238044

Filename

6238044