Title :
Vapor-assisted hybrid bonding of inorganic/organic substrates for 3D hetero integration
Author :
Shigetou, A. ; Suga, T.
Author_Institution :
Nat. Inst. for Mater. Sci. (NIMS), Tsukuba, Japan
Abstract :
Hybrid bonding of metal electrodes, semiconductor substrates, glass substrates, and polymeric materials by using a single vapor-assisted surface activation method at 150 °C and atmospheric pressure is highly feasible. The details of process optimization and some bond examples are stated in this report.
Keywords :
copper; electrodes; glass; integrated circuit bonding; optimisation; polymers; semiconductor materials; three-dimensional integrated circuits; 3D hetero-integration; Cu; atmospheric pressure; glass substrate; inorganic-organic substrate; metal electrode; polymeric material; process optimization; semiconductor substrate; single vapor-assisted surface activation method; vapor-assisted hybrid bonding; Bonding; Polyimides; Substrates; Surface cleaning;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238048
