Title :
Surface protection of copper by self assembled monolayer for low-temperature chip bonding
Author :
Qiu, Lijing ; Nakahara, Kiyoaki ; Ikeda, Akihiro ; Asano, Tanemasa
Author_Institution :
Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
Abstract :
To protect the surface of electroplated Cu from contamination such as oxidation, coating of the surface with a self-assembled monolayer (SAM) was investigated. The coating material investigated was 1-Hexanethiol. Auger electron spectroscopy showed that the SAM coating definitely reduced the oxidation rate of the Cu surface. Change in surface contamination with elevating temperature in the ambient was investigated by measuring wetting angle of water. It showed that the surface protection is kept up to about 100°C. Also, we applied this coating to Cu cone-shaped bump.
Keywords :
Auger electron spectroscopy; copper; electroplated coatings; integrated circuit bonding; integrated circuit interconnections; monolayers; oxidation; self-assembly; surface contamination; three-dimensional integrated circuits; wetting; 1-hexanethiol; Auger electron spectroscopy; Cu; Cu cone-shaped bump; SAM coating; coating material; copper surface protection; electroplated copper; electroplated curate; low-temperature chip bonding; oxidation; self assembled monolayer; surface contamination; water wetting angle; Annealing; Bonding; Coatings; Materials; Surface contamination; Surface morphology; Surface treatment; Cu bump; bump; low-temperature bonding; microjoining; self assembled monolayer; surface passivation; wetting angle;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238050
