Surface protection of copper by self assembled monolayer for low-temperature chip bonding

Author

Qiu, Lijing ; Nakahara, Kiyoaki ; Ikeda, Akihiro ; Asano, Tanemasa

Author_Institution

Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan

fYear

2012

fDate

22-23 May 2012

Firstpage

75

Lastpage

78

Abstract

To protect the surface of electroplated Cu from contamination such as oxidation, coating of the surface with a self-assembled monolayer (SAM) was investigated. The coating material investigated was 1-Hexanethiol. Auger electron spectroscopy showed that the SAM coating definitely reduced the oxidation rate of the Cu surface. Change in surface contamination with elevating temperature in the ambient was investigated by measuring wetting angle of water. It showed that the surface protection is kept up to about 100°C. Also, we applied this coating to Cu cone-shaped bump.

Keywords

Auger electron spectroscopy; copper; electroplated coatings; integrated circuit bonding; integrated circuit interconnections; monolayers; oxidation; self-assembly; surface contamination; three-dimensional integrated circuits; wetting; 1-hexanethiol; Auger electron spectroscopy; Cu; Cu cone-shaped bump; SAM coating; coating material; copper surface protection; electroplated copper; electroplated curate; low-temperature chip bonding; oxidation; self assembled monolayer; surface contamination; water wetting angle; Annealing; Bonding; Coatings; Materials; Surface contamination; Surface morphology; Surface treatment; Cu bump; bump; low-temperature bonding; microjoining; self assembled monolayer; surface passivation; wetting angle;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4673-0743-7

Type

conf

DOI

10.1109/LTB-3D.2012.6238050

Filename

6238050