• DocumentCode
    2597005
  • Title

    Cu to Cu bonding with Cu@Ag core-shell nanoparticles

  • Author

    Song, Jenn-Ming ; Chang, Chih-Hsun ; Wu, Jia-Shin ; Tsai, Chih-Hang ; Chen, Shih-Yun

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
  • fYear
    2012
  • fDate
    22-23 May 2012
  • Firstpage
    83
  • Lastpage
    83
  • Abstract
    In this study, PVP-protected Cu@Ag core-shell nanoparticles with different Ag shell thicknesses were synthesized and applied to Cu to Cu bonding. The phase transformation of Cu@Ag core-shell nanoparticles (about 80 nm in average particle diameter and 10 nm in shell thickness) upon heating in air was investigated via in situ synchrotron radiation X-ray diffraction. The formation temperatures of copper oxides (CuO and Cu2O) were higher than those of pure Cu nanoparticles. This verifies that the oxidation of Cu nanoparticles can be effectively retarded by the Ag shell. It is also demonstrated that firm bonding between two Cu pads could be obtained using Cu-Ag particle pastes after thermal compression at 250 °C.
  • Keywords
    X-ray diffraction; copper; heat treatment; integrated circuit bonding; nanoparticles; nanotechnology; oxidation; polymers; silver; solid-state phase transformations; Ag shell thickness; Cu pad; Cu-Ag; Cu-Cu; PVP-protected Cu@Ag core-shell nanoparticles; air; bonding; copper oxide; heating; in situ synchrotron radiation X-ray diffraction; oxidation; particle diameter; phase transformation; temperature 250 degC; thermal compression; Bonding; Educational institutions; Heating; Intermetallic; Materials; Nanoparticles; Synchrotron radiation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4673-0743-7
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2012.6238053
  • Filename
    6238053