DocumentCode
2597005
Title
Cu to Cu bonding with Cu@Ag core-shell nanoparticles
Author
Song, Jenn-Ming ; Chang, Chih-Hsun ; Wu, Jia-Shin ; Tsai, Chih-Hang ; Chen, Shih-Yun
Author_Institution
Dept. of Mater. Sci. & Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
fYear
2012
fDate
22-23 May 2012
Firstpage
83
Lastpage
83
Abstract
In this study, PVP-protected Cu@Ag core-shell nanoparticles with different Ag shell thicknesses were synthesized and applied to Cu to Cu bonding. The phase transformation of Cu@Ag core-shell nanoparticles (about 80 nm in average particle diameter and 10 nm in shell thickness) upon heating in air was investigated via in situ synchrotron radiation X-ray diffraction. The formation temperatures of copper oxides (CuO and Cu2O) were higher than those of pure Cu nanoparticles. This verifies that the oxidation of Cu nanoparticles can be effectively retarded by the Ag shell. It is also demonstrated that firm bonding between two Cu pads could be obtained using Cu-Ag particle pastes after thermal compression at 250 °C.
Keywords
X-ray diffraction; copper; heat treatment; integrated circuit bonding; nanoparticles; nanotechnology; oxidation; polymers; silver; solid-state phase transformations; Ag shell thickness; Cu pad; Cu-Ag; Cu-Cu; PVP-protected Cu@Ag core-shell nanoparticles; air; bonding; copper oxide; heating; in situ synchrotron radiation X-ray diffraction; oxidation; particle diameter; phase transformation; temperature 250 degC; thermal compression; Bonding; Educational institutions; Heating; Intermetallic; Materials; Nanoparticles; Synchrotron radiation;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238053
Filename
6238053
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