DocumentCode
2597250
Title
Electrical properties of Si-based junctions by SAB
Author
Shigekawa, Naoteru ; Watanabe, Noriyuki ; Higurashi, Eiji
Author_Institution
Grad. Sch. of Eng., Osaka-City Univ., Osaka, Japan
fYear
2012
fDate
22-23 May 2012
Firstpage
109
Lastpage
112
Abstract
Electrical properties of surface-activated-bonding (SAB) based Si/Si and Si/GaN junctions were investigated. Current-voltage (I-V) characteristics of n-Si/n-Si and n-Si/n-GaN junctions revealed ohmic features at room temperature. The p-Si/n-Si junctions showed asymmetric I-V characteristics, whose features were consistent with the scheme of the trap-assisted tunneling for the carrier transport across the interfaces. The I-V characteristics of respective Si/Si dice were close to one another and those of Si/GaN junctions were stable after measurements in varied temperatures. These results suggest that SAB is compatible with the standard semiconductor device process and potentially applicable to fabricating novel devices.
Keywords
semiconductor junctions; wafer bonding; Si-based junctions; carrier transport; current-voltage characteristics; electrical properties; standard semiconductor device process; surface-activated-bonding; trap-assisted tunneling; Bonding; Gallium nitride; Junctions; Silicon; Substrates; Temperature; Temperature measurement; GaN; Si; current-voltage characteristics; hybrid tandem solar cell; surface activated bonding; trap-assisted tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238065
Filename
6238065
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