• DocumentCode
    2597250
  • Title

    Electrical properties of Si-based junctions by SAB

  • Author

    Shigekawa, Naoteru ; Watanabe, Noriyuki ; Higurashi, Eiji

  • Author_Institution
    Grad. Sch. of Eng., Osaka-City Univ., Osaka, Japan
  • fYear
    2012
  • fDate
    22-23 May 2012
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    Electrical properties of surface-activated-bonding (SAB) based Si/Si and Si/GaN junctions were investigated. Current-voltage (I-V) characteristics of n-Si/n-Si and n-Si/n-GaN junctions revealed ohmic features at room temperature. The p-Si/n-Si junctions showed asymmetric I-V characteristics, whose features were consistent with the scheme of the trap-assisted tunneling for the carrier transport across the interfaces. The I-V characteristics of respective Si/Si dice were close to one another and those of Si/GaN junctions were stable after measurements in varied temperatures. These results suggest that SAB is compatible with the standard semiconductor device process and potentially applicable to fabricating novel devices.
  • Keywords
    semiconductor junctions; wafer bonding; Si-based junctions; carrier transport; current-voltage characteristics; electrical properties; standard semiconductor device process; surface-activated-bonding; trap-assisted tunneling; Bonding; Gallium nitride; Junctions; Silicon; Substrates; Temperature; Temperature measurement; GaN; Si; current-voltage characteristics; hybrid tandem solar cell; surface activated bonding; trap-assisted tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4673-0743-7
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2012.6238065
  • Filename
    6238065