DocumentCode
2597323
Title
3D integration applications for low temperature direct bond technology
Author
Enquist, Paul
Author_Institution
Ziptronix, Inc., Morrisville, NC, USA
fYear
2012
fDate
22-23 May 2012
Firstpage
131
Lastpage
131
Abstract
The attributes of low temperature direct bond technology that have and continue to drive its adoption as an industry standard solution for 3D manufacturing are reviewed. These applications include backside illuminated (BSI) image sensors, 3D BSI, 3D memory, RF front ends, and pico-projectors.
Keywords
cryogenic electronics; image sensors; integrated circuit bonding; integrated circuit manufacture; three-dimensional integrated circuits; 3D BSI; 3D integration applications; 3D manufacturing; 3D memory; RF front ends; backside illuminated image sensors; industry standard solution; low temperature direct bond technology; pico-projectors; Bonding; CMOS integrated circuits; Image sensors; Integrated circuit interconnections; Radio frequency; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238069
Filename
6238069
Link To Document