Title :
Temporary-bonding and LowTemp® debonding technology for various applications
Author :
Kawano, Masaya ; Komatsu, Takumi ; Fehkührer, Andreas ; Schachinger, Maria ; Wiesbauer, Harald ; Burggraf, Jürgen ; Burgstaller, Daniel ; Matthias, Thorsten ; Wimplinger, Markus ; Lindner, Paul
Author_Institution :
EV Group Japan K.K., Yokohama, Japan
Abstract :
A standard TB/DB technology capable of wide-range of adhesives is strongly required for various TB/DB applications. Maximum temperature of backside process was investigated for 5 kinds of adhesives. ZoneBOND™ technology has been demonstrated to have much flexibility in adhesives, resulting applicable to various applications.
Keywords :
adhesive bonding; LowTemp debonding technology; TB/DB technology; ZoneBOND technology; adhesives; backside process; temporary-bonding technology; Bonding; High temperature superconductors; Standards; Temperature dependence; Thermal stability; USA Councils;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238074
