Title :
Self-assembly-based 3D integration technologies
Author :
Fukushima, T. ; Bea, J. ; Murugesan, M. ; Lee, K.-W. ; Tanaka, T. ; Koyanagi, M.
Author_Institution :
New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan
Abstract :
We have proposed and developed massively parallel chip self-assembly technologies using surface tension of liquid for advanced chip-to-wafer 3D integration. Here, we introduce flip-chip self-assembly in batch processing and reconfigured wafer-to-wafer 3D integration as a new chip-to-wafer 3D integration approach using self-assembly.
Keywords :
flip-chip devices; self-assembly; surface tension; three-dimensional integrated circuits; wafer level packaging; advanced chip-to-wafer 3D integration approach; batch processing; flip-chip self-assembly; parallel chip self-assembly technologies; reconfigured wafer-to-wafer 3D integration; self-assembly-based 3D integration technologies; surface tension; Assembly; Batch production systems; Educational institutions; Flip chip; Large scale integration; Liquids; Self-assembly;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238075
