DocumentCode
2597455
Title
Assembly of 20μm pitch Cu/Sn micro-bumps using high speed capillary self-alignment
Author
Soussan, Philippe ; Zhang, Wenqi ; Pantouvaki, Marianna ; Delande, Tinne ; Armini, Silvia
Author_Institution
IMEC, Leuven, Belgium
fYear
2012
fDate
22-23 May 2012
Firstpage
153
Lastpage
153
Abstract
We demonstrate high speed sub-micron assembly of 20μm pitch Cu/Sn micro-bumped dies. The positioning of the dies occurs through self-alignment in a liquid with capillary forces in a fraction of second. The surfaces of the dies are functionalized using Self Assembled Monolayer (SAM) to create sufficient wetting contrast as well as providing protection against oxidation during the assembly process.
Keywords
assembling; copper; monolayers; oxidation; self-assembly; tin; wetting; Cu-Sn; assembly process; capillary forces; high speed capillary self-alignment; high speed sub-micron assembly; microbumped dies; microbumps; oxidation; self assembled monolayer; size 20 mum; wetting contrast; Accuracy; Assembly; Bonding; Integrated circuits; Liquids; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238076
Filename
6238076
Link To Document