Title :
Assembly of 20μm pitch Cu/Sn micro-bumps using high speed capillary self-alignment
Author :
Soussan, Philippe ; Zhang, Wenqi ; Pantouvaki, Marianna ; Delande, Tinne ; Armini, Silvia
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
We demonstrate high speed sub-micron assembly of 20μm pitch Cu/Sn micro-bumped dies. The positioning of the dies occurs through self-alignment in a liquid with capillary forces in a fraction of second. The surfaces of the dies are functionalized using Self Assembled Monolayer (SAM) to create sufficient wetting contrast as well as providing protection against oxidation during the assembly process.
Keywords :
assembling; copper; monolayers; oxidation; self-assembly; tin; wetting; Cu-Sn; assembly process; capillary forces; high speed capillary self-alignment; high speed sub-micron assembly; microbumped dies; microbumps; oxidation; self assembled monolayer; size 20 mum; wetting contrast; Accuracy; Assembly; Bonding; Integrated circuits; Liquids; Tin;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238076
