Fabrication of the tile type transceiver module package for X-band phase array radar using selectively anodized aluminum substrate

Author

Chun, Jong-Hoon ; Yeo, Sung-Ku ; Kwon, Young-Se

Author_Institution

Samsung-Thales Co., Ltd., Yongin

fYear

2007

fDate

5-9 Nov. 2007

Firstpage

136

Lastpage

138

Abstract

In this paper, we proposed a tile type transceiver module package for X-band phase array radar system using a selectively anodized aluminum substrate. The proposed solution of package is based on thick anodized aluminum oxide (Al₂O₃) layers and bare chips mounted on aluminum for an effective heat sink. This package method can be further contributed to decreasing cost, reducing module size and managing thermal problem for the microwave high power T/R modules.

Keywords

aluminium compounds; anodisation; phased array radar; radar equipment; thermal management (packaging); transceivers; Al; Al₂O₃; X-band phase array radar; anodized aluminum substrate; thermal problem; thick anodized aluminum oxide layer; tile type transceiver module package fabrication; Aluminum oxide; Costs; Fabrication; Heat sinks; Packaging; Phased arrays; Radar; Thermal management; Tiles; Transceivers; T/R modules; a selectively anodized aluminum substrate; aluminum oxide (Al2O3); tile type package;

fLanguage

English

Publisher

ieee

Conference_Titel

Synthetic Aperture Radar, 2007. APSAR 2007. 1st Asian and Pacific Conference on

Conference_Location

Huangshan

Print_ISBN

978-1-4244-1188-7

Electronic_ISBN

978-1-4244-1188-7

Type

conf

DOI

10.1109/APSAR.2007.4418573

Filename

4418573