Surface activated bonding and transfer of Carbon Nanotube bumps to Au substrates

In this research, bump-shaped Vertically Aligned Mutli-walled Carbon Nanotubes (CNTs) were bonded to Au substrate as multilayer interconnect. In order to lower interconnect resistance between the CNT bumps and the Au substrate, the CNT bumps were covered with Au layer by Ar magnetron sputter, subsequently the CNT bumps and the Au substrates were bonded by surface activated bonding using Ar plasma. As a result, the resistance of CNT bumps including interconnect resistance between them was achieved ~10^-3 Ω, that was equivalent value with conventional solder alloy.