Integrated antenna module for broadband wireless applications

This paper describes a module based system integration using LTCC technology to realize a compact integrated antenna module. This approach enables the adoption of "best-of-breed" CMOS, SiGe and GaAs technologies for RF transceiver, power amplifier and antenna switch components. Key advantages of this module integration approach include integration of embedded passives, BGA or SMT assembly compatibility, co-design of RF components, wire-bond or flip-chip silicon interconnection and compact footprint. The integrated antenna module targeted for WLAN applications was realized using multi-layer LTCC fabrication technology. The module size is 17 × 17 × 2 mm³, and can be seamlessly integrated with any planar antenna configuration. In addition to providing RF integration and improved system performance, this platform also enables improved thermal performance required for high power wireless applications whilst achieving a compact footprint for "plug and play" applications in portable mobile communication products.