Title :
Low temperature bonding with metallic micro-cones for 3D integration
Author :
Chen, Zhuo ; Lu, Qin ; Hang, Tao ; Hu, Anmin ; Li, Ming
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
A novel low temperature bonding method for potential use in 3D integration is reported in this paper. Metallic (Ni and Cu) micro-cones arrays fabricated by one step electroplating were utilized to bond with solder bumps with appropriate temperature and pressure. The bonding strength of this unique architecture was evaluated by shear testing with results comparable to reflow soldering.
Keywords :
bonding processes; copper; electroplating; nickel; reflow soldering; solders; 3D integration; Cu; Ni; bonding strength; electroplating; low temperature bonding method; metallic micro-cones arrays; reflow soldering; shear testing; solder bumps; Bonding; Educational institutions; Microelectronics; Nickel; Solids; Temperature;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238085
