Title :
Novel multiport probing fixture for high frequency measurements in dense via arrays
Author :
Kwark, Y. ; Kotzev, Miroslav ; Baks, Christian ; Gu, Xingfa ; Schuster, Christian
Author_Institution :
IBM, Yorktown Heights, United States
Abstract :
Summary form only given, as follows. A novel multiport probing fixture for high frequency measurements of dense via arrays is presented here. The fixture consists of a 36 mm by 36 mm multilayer PCB plugged into an LGA socket clamped down to the device under test. The test signal is launched from top surface mounted coaxial connectors and fanned in with striplines to a 1 mm via pitch on the bottom side. Custom calibration substrates are used to de-embed the fixture from measurements by applying multiport de-embedding techniques.
Conference_Titel :
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-61284-754-2
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2011.5973495