DocumentCode
2597629
Title
Novel multiport probing fixture for high frequency measurements in dense via arrays
Author
Kwark, Y. ; Kotzev, Miroslav ; Baks, Christian ; Gu, Xingfa ; Schuster, Christian
Author_Institution
IBM, Yorktown Heights, United States
fYear
2011
fDate
5-10 June 2011
Firstpage
1
Lastpage
1
Abstract
Summary form only given, as follows. A novel multiport probing fixture for high frequency measurements of dense via arrays is presented here. The fixture consists of a 36 mm by 36 mm multilayer PCB plugged into an LGA socket clamped down to the device under test. The test signal is launched from top surface mounted coaxial connectors and fanned in with striplines to a 1 mm via pitch on the bottom side. Custom calibration substrates are used to de-embed the fixture from measurements by applying multiport de-embedding techniques.
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location
Baltimore, MD
ISSN
0149-645X
Print_ISBN
978-1-61284-754-2
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2011.5973495
Filename
5973495
Link To Document