DocumentCode :
2597629
Title :
Novel multiport probing fixture for high frequency measurements in dense via arrays
Author :
Kwark, Y. ; Kotzev, Miroslav ; Baks, Christian ; Gu, Xingfa ; Schuster, Christian
Author_Institution :
IBM, Yorktown Heights, United States
fYear :
2011
fDate :
5-10 June 2011
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given, as follows. A novel multiport probing fixture for high frequency measurements of dense via arrays is presented here. The fixture consists of a 36 mm by 36 mm multilayer PCB plugged into an LGA socket clamped down to the device under test. The test signal is launched from top surface mounted coaxial connectors and fanned in with striplines to a 1 mm via pitch on the bottom side. Custom calibration substrates are used to de-embed the fixture from measurements by applying multiport de-embedding techniques.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location :
Baltimore, MD
ISSN :
0149-645X
Print_ISBN :
978-1-61284-754-2
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2011.5973495
Filename :
5973495
Link To Document :
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