Title :
Direct bonding of polymer to glass wafers using surface activated bonding (SAB) method at room temperature
Author :
Suga, Tadatomo ; Matsumae, Takashi ; Matsumoto, Yoshiie ; Nakano, Masashi
Author_Institution :
Univ. of Tokyo, Tokyo, Japan
Abstract :
The room temperature bonding of PEN film to PEN film, PET film to PET film and PEN film to non-alkali glass was performed by the modified SAB method. No void is observed at the bonding interface with the optimized condition.
Keywords :
bonding processes; glass; polymer films; wafer bonding; PEN film; PET film; SAB method; bonding interface; direct bonding; glass wafer; nonalkali glass; polymer wafer; room temperature bonding; surface activated bonding; temperature 293 K to 298 K; Bonding; Films; Glass; Ion beams; Polymers; Surface cleaning;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238098
