Title :
Stencil printing at sub-100 microns pitch
Author :
Desmulliez, M.P.Y. ; Kay, R.W. ; Stoyanov, S. ; Bailey, C.
Author_Institution :
Sch. of Eng. & Phys. Sci., Heriot Watt Univ., Edinburgh, UK
Abstract :
This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 lead-free solder pastes and conductive adhesives. The advantages of the microengineered stencil arc presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.
Keywords :
adhesive bonding; chip scale packaging; conducting materials; fine-pitch technology; integrated circuit interconnections; printing; solders; 100 micron; bonding technology; conductive adhesive; lead-free solder pastes; microengineered stencil arc; print deposits; stencil printing; sub-100 microns pitch; Apertures; Conductive adhesives; Costs; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Packaging machines; Printing; Surface resistance; Wafer scale integration;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396633
