DocumentCode :
2598072
Title :
MOSFET interface state densities of different technologies
Author :
Hofmann, F. ; Krautschneider, W.
Author_Institution :
Siemens AG, Munich, West Germany
fYear :
1989
fDate :
13-14 March 1989
Firstpage :
109
Lastpage :
113
Abstract :
In order to determine the relationship between channel length and interface state density, a test structure with sets of n-channel and p-channel transistors having different channel lengths was used. The transistors had the same width and were situated side by side. A transistor with a gate in a trench was also tested. Charge pumping measurements showed conventional nMOSFETs to have the lowest interface state density, followed by conventional pMOSFETs, LDD nMOSFETs, and trench channel transistors. No increase of interface state density was found for submicron MOSFETs in comparison with long-channel transistors.
Keywords :
insulated gate field effect transistors; interface electron states; semiconductor device testing; semiconductor-insulator boundaries; LDD nMOSFETs; MOSFET interface state densities; channel length; charge pumping; n-channel transistors; nMOSFETs; p-channel transistors; pMOSFETs; submicron MOSFETs; test structure; trench channel transistors; trench gate; Charge measurement; Charge pumps; Current measurement; Interface states; MOSFET circuits; Microelectronics; Substrates; Testing; Transistors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on
Print_ISBN :
0-87942-714-0
Type :
conf
DOI :
10.1109/ICMTS.1989.39293
Filename :
39293
Link To Document :
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