The development of a test vehicle for applications in ambient electronic systems using very thin flexible substrate

In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This substrate is then used to package test chips into a highly miniaturised 3D module. The 3D module consists of 4 IC\´s each having thickness of 50 microns and total module is approximately 450 microns in thickness and with a footprint of 18×7mm². This module is being developed as a technological demonstrator for the "I-Seed". The I-seed is an NMRC envisioned distributed autonomous micromodule that would interact, respond and learn from its surroundings making integration of engineering, computer science and human intelligence a reality.