DocumentCode
2598173
Title
Design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D
Author
Carchon, G. ; Monaco, O. Di ; Vaesen, K. ; Brebels, S. ; De Raedt, W. ; Nauwelaers, B.
Author_Institution
div. ESAT-TELEMIC, Katholieke Univ., Leuven, Belgium
fYear
2000
fDate
2000
Firstpage
167
Lastpage
170
Abstract
We report on the design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D. Using 3-D simulations, it is shown that, for analysis purposes, the vertical metal wall, can be replaced with a thin (5 μm) metal layer with only a small impact on the actual performance. This equivalent structure can be more easily fabricated as the thin metal layer on the top is directly available in the multi-layer technology. This allows for a faster design and characterization of the feedthrough. The transmission line properties (characteristic impedance and propagation constant) of the intrinsic feedthrough are extracted based on the measurement of two equivalent lines with different length. Measurements indicate that a low-loss (<0.4 dB), well matched feedthrough (return loss below -25 dB) can be realized up to at least 50 GHz (feedthrough length of 500 μm)
Keywords
S-parameters; coplanar waveguides; losses; microwave circuits; millimetre wave circuits; multichip modules; thin film circuits; transmission line theory; waveguide transitions; -25 dB; 0.4 dB; 3D simulations; 5 micron; 50 GHz; CPW feedthroughs; characteristic impedance; characterization; multi-layer thin-film MCM-D; propagation constant; transmission line properties; Circuits; Coplanar waveguides; Costs; Dielectric losses; Dielectric substrates; Impedance; Packaging; Spirals; Transistors; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio and Wireless Conference, 2000. RAWCON 2000. 2000 IEEE
Conference_Location
Denver, CO
Print_ISBN
0-7803-6267-5
Type
conf
DOI
10.1109/RAWCON.2000.881881
Filename
881881
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