Title :
Miniature packaged microstrip antenna using wire-bonding technique
Author :
Dou, Weiping ; Chia, M.Y.W.
Author_Institution :
Centre for Wireless Commun., Singapore
Abstract :
A novel concept of using wire-bonding to design a miniature microstrip antenna suitable for packaging is proposed. The bonding wire is readily used in a manufacturing facility for mass production of components which would allow easy fabrication of the new antenna. The impedance characteristics are achieved by exciting two adjacent antenna modes. The measured results of the impedance and radiation patterns over the operating band are presented
Keywords :
UHF antennas; antenna radiation patterns; lead bonding; microstrip antennas; packaging; 2.44 GHz; impedance characteristics; mass production; miniature packaged microstrip antenna; radiation patterns; wire-bonding technique; Antenna accessories; Antenna measurements; Bonding; Fabrication; Impedance; Mass production; Microstrip antennas; Packaging; Production facilities; Wire;
Conference_Titel :
Radio and Wireless Conference, 2000. RAWCON 2000. 2000 IEEE
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-6267-5
DOI :
10.1109/RAWCON.2000.881885
