• DocumentCode
    2598352
  • Title

    Missile Failure Due to Impurities in Electroplates

  • Author

    Mahler, Paul

  • Author_Institution
    Consultant, Picatinny Arsenal, Dover, N.J.
  • fYear
    1963
  • fDate
    Sept. 1963
  • Firstpage
    467
  • Lastpage
    475
  • Keywords
    Bonding; Circuits; Coatings; Copper; Gold; Impurities; Missiles; Surface contamination; Surface treatment; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physics of Failure in Electronics, 1963. Second Annual Symposium on the
  • Conference_Location
    Chicago, IL, USA
  • ISSN
    0097-2088
  • Type

    conf

  • DOI
    10.1109/IRPS.1963.362261
  • Filename
    4207612