Resistance characterization of Au bump and anisotropic conductive adhesives under temperature and moisture conditions

Author

Lee, Charles ; Yeo, Alfred

Author_Institution

Assembly & Interconnect Technol., Infineon Technol. Asia Pacific Pte Ltd, Singapore, Singapore

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

420

Lastpage

425

Abstract

In this work, the effect of temperature and moisture on joint resistance of Au bump and ACA is reported. A flip chip on glass (FCOG) test vehicle was used to study the joint resistance of Au bump and ACA after temperature cycling (-40°C/125°C), temperature humidity testing (85°C/85%RH) and moisture preconditioning (MSL 1/3/5). In general, the results showed that Au bump and ACP has a better performance than Au bump and ACF during temperature cycling, temperature humidity testing and moisture preconditioning. The size of the Au bump and conductive fillers is found to an important factor in achieving a joint with low and stable resistance. For improved temperature and moisture performance, the use of a larger Au bump size with a larger conductive filler size is recommended for ACAs.

Keywords

adhesives; contact resistance; filler metals; flip-chip devices; gold; moisture; solders; ACF; ACP; Au; Au bump; anisotropic conductive adhesives; conductive fillers; flip chip on glass; joint resistance; moisture preconditioning; resistance characterization; temperature cycling; temperature humidity testing; test vehicle; Anisotropic magnetoresistance; Conductive adhesives; Flip chip; Glass; Gold; Humidity; Moisture; Temperature; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396645

Filename

1396645