• DocumentCode
    2598400
  • Title

    FPGA implementation of CIS speech processing strategy for Cochlear Implants

  • Author

    Wu, Shaoyang ; Mai, Songping ; Zhang, Chun

  • Author_Institution
    Grad. Sch. at Shenzhen, Tsinghua Univ., Shenzhen, China
  • Volume
    1
  • fYear
    2011
  • fDate
    15-17 Oct. 2011
  • Firstpage
    162
  • Lastpage
    166
  • Abstract
    Continuous Interleaved Sampling (CIS) is one of the most famous speech processing approaches used in Cochlear Implants speech processors. In the future, to meet the need of totally implantable cochlear implants (TICI), the power consumption needs to be reduced. A CIS application specified integrated circuit (ASIC) has an obvious dissipation advantage compared with a DSP-based circuit. In order to design an ASIC, it is necessary to make a verification of its feasibility. A lot of papers have showed their verification work in software simulation. But this paper proposes a hardware-level CIS model working at 1MHz which can be implemented on a FPGA chip. A preliminary report containing resource occupation of the circuit scale is produced in the end. It gives us a better guidance for the design of a CIS ASIC in the next step.
  • Keywords
    cochlear implants; field programmable gate arrays; lab-on-a-chip; medical signal processing; power consumption; power integrated circuits; signal sampling; speech; speech processing; CIS speech processing; DSP-based circuit; FPGA chip; application specified integrated circuit; cochlear implants speech processors; continuous interleaved sampling; hardware-level CIS model; power consumption; software simulation; totally implantable cochlear implants; Approximation methods; Cochlear implants; Field programmable gate arrays; Filter banks; Finite impulse response filter; Speech processing; CIS; Cochlear Implant; FIR; FPGA; co-simulation; nonlinear;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image and Signal Processing (CISP), 2011 4th International Congress on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-9304-3
  • Type

    conf

  • DOI
    10.1109/CISP.2011.6099967
  • Filename
    6099967