An experimental measurement technique of interconnection RC delay for integrated circuits using the step voltage response

Author

Dos Santos F, Sebastião G. ; Swart, Jacobus W.

Author_Institution

Sao Paulo Univ., Brazil

fYear

1989

fDate

13-14 March 1989

Firstpage

233

Lastpage

238

Abstract

A new measurement technique for RC delay on distributed RC interconnection lines is presented using step voltage excitation. A circuit for RC delay measurement, called CIRCDEM, is proposed. This circuit can provide the RC product measurement of interconnection lines and the RC time delay to switch a gate connected to the end of the line. The interconnection resistance and the parallel-plate capacitance were also obtained by means of measurements on a cross-bridge sheet-resistor test structure and a field MOS capacitor, respectively. The values of R and C obtained from these structures are in accordance to the RC product obtained by means of CIRCDEM when the correction of the edge effect of the interconnection capacitance is taken into account.

Keywords

VLSI; delays; integrated circuit testing; step response; time measurement; timing circuits; CIRCDEM; VLSI edge effect correction; cross-bridge sheet-resistor test structure; distributed RC interconnection lines; field MOS capacitor; integrated circuits; interconnection RC delay; interconnection resistance; parallel-plate capacitance; step voltage excitation; step voltage response; Capacitance; Delay effects; Electrical resistance measurement; Integrated circuit interconnections; Integrated circuit measurements; Measurement techniques; Switches; Switching circuits; Time measurement; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on

Print_ISBN

0-87942-714-0

Type

conf

DOI

10.1109/ICMTS.1989.39315

Filename

39315