Title :
Improved techniques for the measurement and modeling of plastic surface mount packages to 20 GHz
Author :
Jessie, Darryl ; Larson, Lawrence E.
Author_Institution :
Qualcomm CDMA Technol., San Diego, CA, USA
Abstract :
General technique is presented for modeling and characterization of RFIC plastic packages from DC to 20 GHz, and is applied to an industry standard SSOP-8. An improved Thru-Reflect-Line (TRL) measurement method suited for package modeling is presented the modeling approach includes the use of measured data, finite element method (FEM) electromagnetic modeling of the package, and a new circuit synthesis technique to obtain an accurate equivalent circuit. Excellent agreement is obtained to 20 GHz between modeled and measured results, demonstrating the utility of the technique
Keywords :
equivalent circuits; finite element analysis; integrated circuit packaging; microwave measurement; plastic packaging; surface mount technology; 20 GHz; RFIC plastic surface mount package; SSOP-8; Thru-Reflect-Line measurement; circuit synthesis; electromagnetic model; equivalent circuit; finite element method; Bonding; Circuit synthesis; Circuit topology; Electromagnetic measurements; Electromagnetic modeling; Equivalent circuits; Frequency measurement; Frequency synthesizers; Impedance measurement; Plastic packaging;
Conference_Titel :
Radio and Wireless Conference, 2000. RAWCON 2000. 2000 IEEE
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-6267-5
DOI :
10.1109/RAWCON.2000.881900
